Pcb Design And Cad Engineer Job in Qualcomm

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General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

Job Function

Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm hardware and software. Individual will contribute to the dynamic Customer engineering team for end product designs. Individual will be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in definition of product as appropriate. Work closely with Qualcomm customers to design and enable HW PCB s across different applications.

Job Description

As a member of Qualcomm Customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in Mobile, PC, IoT, Automotive and consumer electronics markets. Experience in designing industry Standard form factor modules like SMARC, COM Express, COM HPC, Single Sided LGA, OSM etc Proficient in schematic capture tools like OrCAD and Siemens Mentor Graphics Designer. Proficient in PCB layout tools like Cadence Allegro and Siemens Mentor Graphics Expedition. Proficient in Power Distribution Network (PDN) methodologies and schemes. Proficient in routing topologies for PC-DDR, DDR, and termination schemes. Proficient in routing schemes of high-speed interfaces like USB 3, PCIe 3+, Ethernet (1 Gbps or higher) and other SERDES interfaces Knowledge of high-speed simulation tools like Ansys Q3D, Cadence Sigrity, and Sentinel is a plus. Experience in analog, power, digital, and RF PCB layout aspects. Hands-on experience with multilayer PCBs (at least 12 layers, at least 10 cm x 10 cm, with a processor or FPGA having > 500 pins and pitch smaller than 0.5 mm) and upto 2.00mm thickness. Knowledge of PCB layout tools like Altium Designer and Mentor PADS is a plus. Knowledge of thermal impacts and mechanical constraints on a PCB. Experience in documenting PCB guidelines, checklists, and rules. Candidate should have 5-8 years of relevant experience. Past expertise in interacting with multiple teams in HW, domain skills in Digital/High Speed/SoC is desirable.

Preferred Qualifications

Sound understanding of HW and PCB design. Strong understanding of signal integrity and electromagnetic compatibility (EMC) principles. Experience with Design for Manufacturability (DFM) and Design for Testability (DFT) practices. Familiarity with IPC standards for PCB design and manufacturing.

Ability to perform design reviews and provide constructive feedback. Excellent problem-solving skills and attention to detail. Effective communication skills for collaborating with cross-functional teams. Ability to manage multiple projects and meet deadlines.

Keywords

PCB Board Design, Modules, PCB CAD, SMPS, LDO, Antenna, SMARC, COM Express, COM HPC, Single Sided LGA, OSM, HPCMini

Educational Requirements Required:

Bachelor's, Electronics and/or Electrical Engineering